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Sounds like you're making an issue where there is none.I find the "And we're still doing something with AM4, maybe" infuritating and paralysing. I'm very happy with the idea of a Final Upgrade on the AM4 platform, then upgradnig the GPU, then swapping the rest of the machine out underneath the GPU. Was a nice, simple plan that worked.
Now I just have uncertainty. Will a 5800x3D it be a final upgrade? I've got no idea. Kudos for long lived support for the socket. But the complete lack of guidence is maddening!
Sounds like you're making an issue where there is none.
I would be very surprised if they release high end parts sufficient to "paralyse" your purchase decisions.
If you feel the longevity of AM4 is an issue, ignore it and buy what you need now, because if you wait you'll never buy anything. That has always been the case and doesn't change just because AMD have turned around and said "y'know, 5800X3D might not be the last AM4 CPU".
I've changed mortgage twice in the last 10 years, had two chiildren and bought 2 CPUs. It's not something to do lightly. Even if I am over thinking itWith the greatest respect, it's a CPU upgrade, not a mortgage or life-critical investment. You're overthinking it.
And yet AMD's X570 chip required active cooling (and the internet melted down as a result), yet the ASMedia B550 and X570S chips don't need a fan.AMD should of stuck to making the chipsets instead of giving it to ASMedia...
And yet AMD's X570 chip required active cooling (and the internet melted down as a result), yet the ASMedia B550 and X570S chips don't need a fan.
So I'm fairly sure it's a better job giving the chipset job to ASMedia. Unless, of course, ASMedia **** up regularly like they did with X570 and force AMD into rushing their own.
That was the confusion when Asus launched the Dark Hero. It's not actually X570S, it's a passive X570. Still the same repurposed Zen 2 IO on Glo Fo 16nm, so still the same ridiculous TDP. The S refresh uses a refined chip to slash the TDP, so it's still AMD's hodge-podge design because ASMedia dropped the ball originally, but it's had a few tweaks and on a better process.I'm pretty sure X570S is still AMD chipset without the cooling fan
Well no, the best ASMedia can do is PCIe 5, because they're doing the 600 series chipsets. Not sure how ASMedia producing a PCIe 4 chipset when PCIe 4 was current gen is somehow a bad thing...The best asmedia could do though was PCIe 4
Not true. X670E is Gen 5 across the board by design. X670 has the design flexibility to be Gen 5 across the board at reduced lane counts if the motherboard vendor chooses to. B660 will probably be Gen 5 on the first 16x slot and a SSD coming off the CPU, with Gen 4 making up the rest of the board.you are only getting the PCIe 5 from the CPU with zen4.
X670E, not gen 5 across the board. All M.2 slots are gen4 except the first one which gen5, and the first GPU slot has full x16 lanes gen5, the other x16 slot is gen5 but only x8, this is the same pattern for all X670E boards, it's there in black and white, the boards that do support gen5 m.2 slots across the board cut other things like USB4 and reduce the GPU slot to x8 like the Gigabyte Master.
This solution is based on a 12 inch wafers and in the future the industry will move to 18 inch wafers, which means higher utilization of the fab and better pricing per wafer and eventually better prices to the end user. Basically, much more dies per wafer. This die per wafer calculator show the various options per wafer size: https://anysilicon.com/die-per-wafer-formula-free-calculators/I wonder how much the premium is on the 5nm wafer space per mm vs 7nm per mm? Perhaps continuing Zen3 chiplets on 7nm works out more expensive than moving to a 5nm Zen4 die for current AM4 parts, especially when buying wafers in lower volumes.
I don't think so, more likely that they will keep prices same so more profit for them, price will go up every year, and when they migrate to something better/cheaper, at best price will stay same for us, but going down? nope, they never go down.This solution is based on a 12 inch wafers and in the future the industry will move to 18 inch wafers, which means higher utilization of the fab and better pricing per wafer and eventually better prices to the end user. Basically, much more dies per wafer. This die per wafer calculator show the various options per wafer size: https://anysilicon.com/die-per-wafer-formula-free-calculators/